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Jetter Technologies pride itself with a wide range of industrial automation applications. Some of our past projects include Automold, Test Handler, Mooring Winch and Cutting Saws.
Auto mold : IC encapsulation process, by means of molding technique to encapsulate lead frame or substrate after a wafer die is placed on it.
Saw-Sort Singulation : Molded substrates will be dice into single IC and these individual IC have to be sorted accordingly.
Test-Handler : Individual IC will be send to an IC tester for testing and sorting.
Solder Ball Placement : Solder ball will be placed onto the substrate (to act as the contact point for IC) using vision alignment.
Flip-Chip M/C : Bonding of Wafer die directly bonded onto substrate using high accuracy vision system. High speed and accuracy are required to achieve necessary output.
Water Jet Cutting Machine : Material cutting application using high pressured water pump and abrasive additives.
Mooring Winch : 4 Winches operation control on board sea vessel.
Vessel Alarm Monitoring System : To monitor all sensors on board ship and log activites into database and direct printer log print. Multi terminals across several location to display error to inform Engineers.
Thruster Control : Control thruster on a working barge. Use to control the direction and speed of the vessel.
Window Frame Slot cutting m/c
Single/Dual Head Cutting Saw
Material Handling, Loading and Unloading